| Thermal Stress Analysis Thermal stress analysis evaluates the internal stresses caused by temperature gradients during 3D printing, affecting warping, cracking, and dimensional accuracy. It uses finite element analysis (FEA) to simulate thermal expansion, contraction, and residual stresses. Proper analysis optimizes print orientation, support placement, and cooling strategies. It is essential for metal 3D printing, high-temperature polymers, and functional prototypes. Advanced simulation tools predict thermal deformation, ensuring structural integrity, mechanical performance, and dimensional stability. Thermal stress analysis supports design validation and manufacturing reliability. |
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